Press Release

Official Updates and Coverage

From Headlines to Highlights

Malaysia–Japan Alliance to Accelerate Edge AI Semiconductor Development

19 June 2026

Selangor Launches Triple Accelerator Programme 2026 and New Wira AI Initiative, Expanding Support for Startups and SMEs

11 June 2026

Leaders Who Climbed Together: Sidec Marks the Close of CXO Club at The Final Ascent Gala Dinner

14 May 2026

Malaysia And Brazil Forge IC Design Talent Partnership With Launch Of Championship Experience

7 May 2026

Sidec Brings Five Malaysian Tech Startups to SusHi Tech Tokyo 2026, Cementing Selangor’s Place on the Global Innovation Map

7 May 2026

ASEM Opens Applications for 300 Semiconductor Engineers; First Cohort Drew 1,900+ Applicants for 120 Spot

4 May 2026

Malaysia Semiconductor IC Design Park Reaches 302 Engineers Hired, Majority Fresh Graduates

27 April 2026

Building Global Innovation Bridges: Strengthening Malaysia–India Deep-Tech Collaboration

22 April 2026

Sidec, ASEM and CREST Catalysing Collaboration to Accelerate Malaysia’s Semiconductor Start-up and Talent Ecosystem

20 April 2026

Retail-X Returns: Powering Malaysia’s Next Generation of Tech-Enabled Retail SMEs

17 April 2026