Integrated Marketing, PR, Content & Video Production Malaysia
Semiconductor IC Park 2 (IC Park 2)
Submission Instructions
All completed proposals must be submitted via email to:
📧 [email protected]
Please ensure your submission is received by the deadline stated above. Late submissions beyond 1 October 2025 will not be considered.
Introduction
Sidec Sdn Bhd is spearheading the development of Malaysia Semiconductor IC Park 2 (IC Park 2), a key initiative to expand Malaysia’s semiconductor ecosystem and attract global investors. To support this, we seek a qualified vendor to deliver integrated marketing, PR, content, and video production services that amplify stakeholder engagement and strengthen Malaysia’s positioning as a semiconductor hub.
Objectives
The appointed vendor will:
● Develop and execute a campaign strategy that builds awareness of IC Park 2.
● Deliver media coverage and stakeholder communications across top-tier outlets.
● Create high-quality content and video assets that support investor outreach and public engagement.
Scope of Work
a. Marketing & Branding
● Campaign concept & messaging framework
● Creative assets (visuals, infographics, digital banners)
●Social media and digital ad placement recommendations
b. Media / PR
● Press releases (drafting, distribution)
● Media pitching and securing Tier-1 coverage
● Media Q&A preparation and coordination
c. Content Development
● Key speeches for executives
● Feature stories & thought-leadership articles
● Website and social copywriting
● Media kit preparation
d. Video Production
● 2–3 corporate videos (2–3 mins each)
● 30–60 second social media cutdowns
● Scriptwriting, filming, editing, and subtitles
Deliverables & Timeline
| Deliverable | Timeline (from award) |
|---|---|
| Campaign Plan & Calendar | 2 weeks |
| First Video Draft | 4 weeks |
| Minimum 5 Feature Media Placements | By campaign midpoint |
| Final Report (coverage, engagement, PR value) | Project close |
Budget & Commercial Terms
Maximum Budget: RM100,000 (all-inclusive)
Payment Terms
30%,50%,10%,10%
Vendors must submit
Proposal Submission Requirements
1. Technical Proposal
● Understanding of project and proposed approach
● Team composition and key personnel
● Workplan and timeline
● Relevant past projects (esp. semiconductor/GLC/tech sectors)
● ESG/compliance initiatives
2. Financial Proposal
● Detailed cost breakdown (aligned to scope)
● Payment schedule
Submission Details
● Deadline: 1 October 2025
● Submission Format: PDF (Technical & Financial proposals in separate files)
● Submission Email: [email protected]
● Inquiries / Clarifications: Contact Encik Shukur at 017-320 6195
● Deadline for Questions: 26 September 2025
Terms & Conditions
a. Sidec reserves the right to accept or reject any or all proposals without assigning any reason.
b. All proposals shall remain valid for 60 days from submission deadline.
c. Confidentiality must be maintained throughout the engagement.
